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P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
Rev. 03 -- 24 January 2008 Objective short data sheet
1. General description
1.1 SmartMX family approach
The new CMOS14 SmartMX family members feature a modular set of devices with:
* * * * * * * * * * * * * *
12 KB to 144 KB EEPROM 200 KB user ROM 6144 B RAM High-performance secured Public Key Infrastructure (PKI) coprocessor (RSA, ECC) Secured dual/triple-DES coprocessor Secured AES coprocessor Memory Management Unit (MMU) ISO/IEC 7816 contact interface Optional ISO/IEC 14443 A Contactless Interface Unit (CIU) Optional S2C interface for NFC communication link 5-metal-layer 0.14 m CMOS technology EEPROM with typical 500000 cycles endurance and minimum 20 years retention time Broad spectrum of delivery types Optional certified crypto library modules for RSA, ECC, DES, AES, SHA and PRNG
1.2 SmartMX family properties
The long-term approved SmartMX family features a significantly enhanced secure smart card IC architecture. Extended instructions for Java and C code, linear addressing, high speed at low power and a universal memory management unit are among many other improvements added to the classic 80C51 core architecture. The technology transfer step from 5-metal-layer 0.18 m to 5-metal-layer 0.14 m CMOS technology offers now even more advantages in terms of security features, memory resources, crypto coprocessor calculation speed for RSA and ECC as well as availability of secure hardware support for 2/3-key Digital Encryption Standard (DES) and Advanced Encryption Standard (AES) operations. The availability of contact interface, optional contactless or S2C interface enables the easy implementation of native or open platform and multi-application operating systems in market segments like e.g. banking, E-passport, ID card, Health Card, secure access, Java card, Near Field Communication (NFC) connectable mobile hand sets as well as Trusted Platform Modules (TPM).
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.3 Naming conventions
Table 1. x y Naming conventions Type of category: C = PKI controller + Triple-DES coprocessor + AES coprocessor on selected products Interface options: C = contact interface - ISO/IEC 7816 D = dual interface - ISO/IEC 7816 + ISO/IEC 14443 contactless interface N = ISO/IEC 7816 + S2C Interface for NFC zzz Amount of non-volatile memory in KB, increasing count for further product options P5xyzzz SmartMX platform
1.4 Cryptographic hardware coprocessors
1.4.1 FameXE coprocessor
The approved and modular FameXE architecture supports the trend of increasing RSA keys with faster execution speeds as well as Elliptic Curve Cryptography (ECC) based on GF(p) or GF(2n) at best performance. FameXE supports RSA with an operand length of up to 8-kbit (up to 4-kbit with intermediate storage in RAM only). The FameXE PKI coprocessor supports 192-bit ECC key length that offers the same level of security as 2048-bit RSA. An ECC GF(2n) based signature, using a 163-bit key can be executed in less than 30 ms providing a security level comparable to 1024-bit RSA. The operand size for ECC, supported by FameXE, is only limited by the 2.5 KB size of the FXRAM. FameXE is easy to use and the flexible interface provides programmers with the freedom to implement their own cryptology solutions. A secured and CC EAL5+ certified crypto library providing a large range of required functions will be available for all devices in order to support customers in implementing public key-based solutions.
1.4.2 Triple-DES coprocessor
The DES for widely used symmetric encryption is supported by a dedicated, high performance, highly attack resistant hardware coprocessor. Single DES and triple-DES, based on two or three DES keys, can be executed within less than 40 s. Relevant standards (ISO/IEC, ANSI, FIPS) and Message Authentication Code (MAC) are fully supported. A secured crypto library element for DES is available.
1.4.3 AES coprocessor
SmartMX is the first smart card microcontroller platform to provide a dedicated high performance 128-bit parallel processing coprocessor to support secure AES. The implementation is based on FIPS197 as standardized by the National Institute for Standards and Technology (NIST), and supports key lengths of 128-bit, 192-bit, and 256-bit with performance levels comparable to DES. AES is the next generation for symmetric data encryption and recommended successor of DES providing significantly improved security level. A secured crypto library element for AES is available.
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
2 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.5 SmartMX interfaces
1.5.1 SmartMX contact interface
Operating in accordance with ISO/IEC 7816, the SmartMX contact interface is supported by a built-in Universal Asynchronous Receiver/Transmitter (UART), which enables data rates of up to 1 Mbit/s allowing for the automatic generation of all typical baud rates and supports transmission protocols T = 0 and T = 1. Either one or two additional IOs are available.
1.5.2 SmartMX contactless interface
The optional contactless interface is fully compatible with ISO/IEC 14443 A as well as NXP Semiconductors field proven MIFARE technology. A dedicated Contactless Interface Unit (CIU) manages and supports communication using data rates of up to 848 kbit/s. A true anti-collision method (according to ISO/IEC 14443-3) enables multiple cards to be handled simultaneously. The optional MIFARE functionality provided in configurations B1 (MIFARE 1 KB emulation) and B4 (MIFARE 4 KB emulation) safeguard the interface compatibility with any installed MIFARE infrastructure. The ability to run the MIFARE protocol concurrently with other contactless transmission protocols implemented by the user OS (T = CL or self defined) enables the combination of new services and existing applications based on MIFARE (e.g. ticketing) on a single dual interface controller based smart card. A tutorial software library for ISO/IEC 14443-3 and ISO/IEC 14443-4 is available to support NXP Semiconductors customers for easy integration of the contactless technology into current system solutions.
1.5.3 SmartMX S2C interface
The S2C interface is intended for use with NXP Semiconductors NFC circuits (e.g. PN511, PN531) in order to configure a secure NFC system, e.g. in mobile hand sets. Operated both in Contact mode (ISO/IEC 7816) and in S2C mode the user defines the final function of the controller chip with its operating system. This allows the same level of security, functionality and flexibility for the contact interface as well as for S2C interface. The S2C interface is connected to the internal ISO 14443 CIU. The CIU handles the demodulation and the modulation of the S2C signals in a way that a full contactless communication via this interface and the NFC IC can be enabled. As the S2C interface is connected to the CIU the power of the P5CN080/P5CN144 has to be supplied via the VDD and VSS pads to use the S2C interface. The S2C interface does not need any software adaptation compared to the normal contactless operation. Connected to the S2C interface of a NFC IC the device is compatible with existing MIFARE reader infrastructure and the optional emulation modes of MIFARE 1 KB or MIFARE 4 KB enable fast system integration and backward compatibility to MIFARE based cards. The communication on the S2C interface supports both the ISO/IEC 14443 A part 3 and the ISO/IEC 14443 part 4.
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
1.6 Security features
SmartMX incorporates a big range of both inherent and OS controlled security features as counter measure against all types of attacks. NXP Semiconductors has used the deep knowledge of chip security, combined with the used handshaking circuit technology, the very dense 5-metal-layer 0.14 m technology, glue logic and active shielding methodology for optimum results in CC EAL5+, EMVCo and other third party certifications and approvals. SmartMX Memory Management Unit (MMU), designed to define various memory segments and assign security attributes accordingly, supports a strong firewall concept that keeps different applications separate from each other. Only the System mode has full access privileges to all memory space and on-chip peripherals, while the User mode only has privileges defined upon card personalization and executed under the control of the System mode.
1.7 Security evaluation and certificates
The reached target of the certification is CC EAL5+. Also third party approvals like e.g. EMVCo (Visa, CAST), ZKA and others, depending on the application requirements, are available. NXP Semiconductors continues to drive forward third party security evaluations to provide its customers with the relevant information and documentation needed to execute subsequent composite evaluations of implemented applications.
1.8 Optional crypto library
NXP Semiconductors will offer for all family types an optional crypto library:
* Various algorithms
- AES encryption and decryption using the AES coprocessor - DES and Triple-DES encryption and decryption using the DES coprocessor - RSA encryption and decryption, signature generation and verification for straightforward and CRT keys up to 5024 bits - RSA key generation - ECC over GF(p) signature generation and verification (ECDSA) and Diffie-Hellman key exchange for keys up to 544 bits - ECC over GF(p) key generation - ECC over GF(2n) signature generation and verification (ECDSA) and Diffie-Hellman key exchange for keys up to 571 bits - ECC over GF(2n) key generation - SHA-1, SHA-224 and SHA-256 hash algorithm - Pseudo-Random Number Generator (PRNG)
* Easy to use API for all algorithms * Secure operation in contact as well as in the contactless mode * Latest built-in security features to avoid power (SPA/DPA), timing and fault attacks
(DFA)
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
4 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
* Common criteria CC EAL5+ certification planned [except ECC over GF(2n)] according
to BSI-PP-0002 protection profile
2. Features
2.1 Standard family features
I EEPROM: choice of 12 KB, 20 KB, 40 KB, 72 KB, 80 KB or 144 KB N Data retention time: 20 years minimum N Endurance: 500000 cycles typical I ROM: 200 KB I RAM: 6144 B N 256 B IRAM + 3.25 KB standard RAM usable for CPU N 2560 B FXRAM usable for FameXE I Dedicated Secure_MX51 Smart Card CPU (Memory eXtended/enhanced 80C51) N 5-metal-layer 0.14 m CMOS technology N Operating in Contact and Contactless mode (dependent on family type option) N Featuring a 24-bit universal memory space, 24-bit program counter N Combined universal program and data linear address range up to 16 MB N Additional instructions to improve: - Pointer operations - Performance - Code density of both C and Java source code I ISO/IEC 7816 contact interface I PKI coprocessor FameXE I Support of major Public Key Cryptography (PKC) systems like RSA, Elgamel, DSS, Diffie-Hellman, Guillou-Quisquater, Fiat-Shamir and Elliptic Curves N 8192 bits maximum key length for RSA with randomly chosen modulus N 4096 bits maximum key length for calculation within RAM N 32-bit interface N Boolean operations for acceleration of standard, symmetric cipher algorithms I High speed Triple-DES coprocessor (64-bit parallel processing DES engine) N Two or three keys loadable N DES3 performance < 40 s I High speed AES coprocessor (128-bit parallel processing AES engine) I Memory Management Unit (MMU) I Low power and low voltage design using NXP Semiconductors handshaking technology I Multiple source vectorized interrupt system with four priority levels I Watch exception provides software debugging facility I Multiple source RESET system I Two 16-bit timers I High reliable EEPROM for both data storage and program execution I Bytewise EEPROM programming and read access
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
I Versatile EEPROM programming of 1 B to 64 B at a time or, optionally 1 B to 128 B at a time I Typical EEPROM page erasing time: 1.7 ms I Typical EEPROM page programming time: 1.0 ms N Power-saving Idle mode N Wake-up from Idle mode by RESET or any activated interrupt N Power-saving Sleep (power-down) mode or Clockstop mode N Wake-up from Sleep or Clockstop mode by RESET or external interrupt I Contact configuration and serial interface according to ISO/IEC 7816: GND, VDD, CLK, RST_N, IO1 I ISO/IEC 7816 UART supporting standard protocols T = 0 and T = 1 as well as high speed personalization up to 1 Mbit/s I External or internally generated configurable CPU clock I 1 MHz to 10 MHz operating external clock frequency range N Internal CPU clock up to 30 MHz with synchronous operation N Internal clocking independent of externally applied frequency I High speed 16-bit CRC engine according to ITU-T polynomial definition I Low power Random Number Generator (RNG) in hardware, AIS-31 compliant I 1.62 V to 5.5 V extended operating voltage range for class C, B and A I Optional extended Class B operation mode (targeted for battery supplied applications) I -25 C to +85 C ambient temperature I Broad spectrum of delivery types: N Wafers N Modules
2.2 Product specific family features
I P5CC021, P5CC040, P5CC073, P5CC080 and P5CC144 N ISO/IEC 7816 contact interface N Two additional IO ports IO2 and IO3 for full-duplex serial data communication I P5CD012, P5CD020, P5CD040, P5CD080 and P5CD144 N CIU fully compatible with ISO/IEC 14443 A: - Fully supports the T = CL protocol according ISO/IEC 14443-4 - Data transfer rates supported: 106 kbit/s, 212 kbit/s, 424 kbit/s and 848 kbit/s N MIFARE contactless interface according ISO/IEC 14443-2: - 13.56 MHz operating frequency - Reliable communication due to 100 % ASK - High speed efficient frame support - True anticollision N MIFARE reader infrastructure compatibility N Optional MIFARE 1 KB and MIFARE 4 KB emulation N Two additional IO ports IO2 and IO3 for full-duplex serial data communication I P5CN080 and P5CN144 N S2C interface N One additional IO port IO2 for full-duplex serial data communication
P5CX012_02X_40_73_80_144_FAM_SDS_3 (c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
2.3 Security features
I Enhanced security sensors: N Low and high clock frequency sensor N Low and high temperature sensor N Low and high supply voltage sensor N Single Fault Injection (SFI) attack detection N Light sensors (included integrated memory light sensor functionality) I Electronic fuses for safeguarded mode control I Active shielding I Unique ID for each die I Clock input filter for protection against spikes I Power-up and power-down reset I Optional programmable card disable feature I Memory security (encryption and physical measures) for RAM, EEPROM and ROM I Memory Management Unit (MMU) including memory protection: N Secure multi application operating systems via two different operation modes: System mode and User mode N OS controlled access restriction mechanism to peripherals in User mode N Memory mapping up to 8-MB code memory N Memory mapping up to 8-MB (64-kbit) data memory I Optional disabling of ROM read instructions by code executed in EEPROM I Optional disabling of any code execution out of RAM I EEPROM programming: N No external clock N Hardware sequencer controlled N On-chip high voltage generation N Enhanced error correction mechanism I 64-B or 128-B EEPROM for customer-defined Security FabKey. Featuring batch, wafer or die-individual security data, included encrypted diversification features on request I 14 B user write protected security area in EEPROM (byte access, inhibit functionality per byte) I 32 B write once security area in EEPROM (bit access) I 32 B user read only area in EEPROM (byte access) I Customer specific EEPROM initialization available
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
2.4 Design-in support
I Approved development tool chain: N Keil PK51 development tool package inclusive Vision3/dScope C51 simulator, additional specific hardware drivers inclusive simulation of contactless interface and ISO/IEC 7816 card interface board. A SmartMX DBox allows software debugging and integration tests. N Ashling Ultra-Emulator platform, stand alone ROM prototyping boards and ISO/IEC 7816 and ISO/IEC 14443 card interface board. Code coverage and performance measurement software tools for real time software testing. N Dual interface dummy modules OM6711 (PDM 1.1 - SOT658) with special antenna bonding on C4 and C8 for testing the implanting process and antenna connection. I Software libraries: N Libraries supporting contactless communication according to ISO 14443, part 3 and 4 N EEPROM read/write routines
3. Applications
3.1 Application areas
I I I I I I Banking Java cards E-passports ID cards Secure access Trusted platform modules
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
4. Quick reference data
Table 2. VDD Quick reference data Conditions Class A: 5 V range Class B: 3 V range Class BE: 3 V range Class C: 1.8 V range
[1]
[1]
Symbol Parameter supply voltage
Min 4.5 2.7 2.2 1.62
Typ 5.0 3.0 3.0 1.8
Max 5.5 3.3 3.3 1.98
Unit V V V V
In case of extended Class B (Class BE) operation mode (targeted for battery supplied applications), the class C is not supported.
5. Ordering information
Table 3. Ordering information Package Name P5CC021UA P5CC040UA P5CC073UA P5CC080UA P5CC144UA P5CD012UA P5CD020UA P5CD040UA P5CD080UA P5CD144UA P5CN080UA P5CN144UA P5CD012UE P5CD020UE P5CD040UE P5CD080UE P5CD144UE P5CC021XS P5CC040XS P5CC073XS P5CC080XS P5CC144XS P5CD012X1 P5CD020X1 P5CD040X1 P5CD080X1 P5CD144X1
P5CX012_02X_40_73_80_144_FAM_SDS_3 (c) NXP B.V. 2008. All rights reserved.
Type number
Description 8 inch wafer (sawn; 150 m thickness; on film frame carrier; electronic fail die marking according to SECSII format)
Version
FFC
FFC
8 inch wafer (sawn; 75 m thickness; on film frame carrier; electronic fail die marking according to SECSII format)
PCM1.1
contact chip card module (super 35 mm format, 8-contact)
SOT658
PDM1.1
contactless chip card module (Plug-in type; super 35 mm format, 8-contact)
SOT658
Objective short data sheet
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
Ordering information ...continued Package Name Description Version PDM1.1 contactless chip card module (super 35 mm format, SOT658 8-contact)
Table 3.
Type number P5CD012X0 P5CD020X0 P5CD040X0 P5CD080X0 P5CD144X0 P5CD012A4 P5CD020A4 P5CD040A4 P5CD080A4 P5CD144A4 P5CD012A6 P5CD020A6 P5CD040A6 P5CD080A6 P5CD144A6 Table 4. Product type P5CD012 P5CC021 P5CD020 P5CC040 P5CD040 P5CC073 P5CN080 P5CC080 P5CD080 P5CN144 P5CC144 P5CD144 Feature table EEPROM [KB] 12 20 20 40 40 72 80 80 80 144 144 144 User ROM [KB] 200 200 200 200 200 200 200 200 200 200 200 200 Total RAM [KB] 6 6 6 6 6 6 6 6 6 6 6 6
MOB4
plastic leadless module carrier package; 35 mm wide tape
SOT500-2
MOB6
plastic leadless module carrier package; 35 mm wide tape
SOT500-3
CXRAM [KB] 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5
FXRAM Coprocessor [KB] FameXE DES 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes yes
AES yes yes yes yes yes yes yes yes yes yes yes yes
ISO 7816 Interface option IO pads 3 3 3 3 3 3 3 3 3 2 3 3 dual interface contact dual interface contact dual interface contact contact + S2C interface for NFC contact dual interface contact + S2C interface for NFC contact dual interface
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
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Objective short data sheet Rev. 03 -- 24 January 2008
(c) NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
6. Functional diagram
NXP Semiconductors
P5CC021 P5CC040 P5CC073 P5CC080 P5CC144
ROM
EEPROM 20 KB/40 KB/ 72 KB/80 KB/ 144 KB DATA AND PROGRAM MEMORY
RAM
IO1 IO2 IO3 PROGRAMMABLE IO 1, 2, 3 UART ISO 7816
200 KB PROGRAM MEMORY
6144 B DATA MEMORY
FameXE ENHANCED PUBLIC KEY COPROCESSOR e.g. RSA, ECC
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Secure dual interface and contact PKI smart card controller
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
SECURITY SENSORS RESET GENERATION
TIMERS
TRIPLE-DES COPROCESSOR CRC16 FAST RNG
AES COPROCESSOR
16-bit 16-bit T0 T1 VOLTAGE REGULATOR
VDD
VSS
001aae954
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Fig 1. Functional diagram P5CC021/P5CC040/P5CC073/P5CC080/P5CC144
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Objective short data sheet Rev. 03 -- 24 January 2008
(c) NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
NXP Semiconductors
P5CD020 P5CD040 P5CD080 P5CD144
LA RF INTERFACE LB 200 KB PROGRAM MEMORY PROGRAMMABLE IO 1, 2, 3 UART ISO 7816 CIU ISO 14443 ROM EEPROM 20 KB/40 KB/ 80 KB/144 KB DATA AND PROGRAM MEMORY RAM
IO1 IO2 IO3
6144 B DATA MEMORY
FameXE ENHANCED PUBLIC KEY COPROCESSOR e.g. RSA, ECC
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Secure dual interface and contact PKI smart card controller
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
SECURITY SENSORS RESET GENERATION
TIMERS
TRIPLE-DES COPROCESSOR CRC16 FAST RNG
AES COPROCESSOR
16-bit 16-bit T0 T1 VOLTAGE REGULATOR
VDD
VSS
001aae953
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Fig 2. Functional diagram P5CD012/P5CD020/P5CD040/P5CD080/P5CD144
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Objective short data sheet Rev. 03 -- 24 January 2008
(c) NXP B.V. 2008. All rights reserved. P5CX012_02X_40_73_80_144_FAM_SDS_3
NXP Semiconductors
P5CN080 P5CN144
SIGIN S2C INTERFACE SIGOUT 200 KB PROGRAM MEMORY PROGRAMMABLE IO 1, 2 IO2 UART ISO 7816 CIU ISO 14443 ROM EEPROM 80 KB/ 144 KB DATA AND PROGRAM MEMORY RAM
IO1
6144 B DATA MEMORY
FameXE ENHANCED PUBLIC KEY COPROCESSOR e.g. RSA, ECC
P5Cx012/02x/40/73/80/144 family
MEMORY MANAGEMENT UNIT (MMU)
Secure dual interface and contact PKI smart card controller
CLK
CLOCK FILTER
CLOCK GENERATION
SECURE_MX51 CPU
RST_N
SECURITY SENSORS RESET GENERATION
TIMERS
TRIPLE-DES COPROCESSOR CRC16 FAST RNG
AES COPROCESSOR
16-bit 16-bit T0 T1 VOLTAGE REGULATOR
VDD
VSS
001aae955
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Fig 3. Functional diagram P5CN080/P5CN144
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
7. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Symbol Parameter VDD VI II IO Ilu Vesd supply voltage input voltage input current output current latch-up current electrostatic discharge voltage any signal pad pad IO1, IO2 or IO3 pad IO1, IO2 or IO3 VI < 0 V or VI > VDD pads VDD, VSS, CLK, RST_N, IO1, IO2, IO3 pads LA, LB Ptot Tstg
[1] [2] [3]
[1]
Conditions
Min -0.5 -0.5 -
Max +6.0 VDD + 0.5 15.0 15.0 100 4.0
Unit V V mA mA mA kV
[1] [2] [3]
-
2.0 1 -
kV W
total power dissipation storage temperature
MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 k; Tamb = -25 C to +85 C. Depending on appropriate thermal resistance of the package. Depending on delivery type, refer to NXP Semiconductors General Specification for 8" Wafer and to NXP Semiconductors Contact & Dual Interface Chip Card Module Specification.
8. Abbreviations
Table 6. Acronym AES API ASK CIU CRC CRT DES DFA DPA DSS ECC ECDSA EEPROM GF MAC MMU
P5CX012_02X_40_73_80_144_FAM_SDS_3
Abbreviations Description Advanced Encryption Standard Application Programming Interface Amplitude Shift Keying Contactless Interface Unit Cyclic Redundancy Check Chinese Remainder Theorem Digital Encryption Standard Differential Fault Analysis Differential Power Analysis Digital Signature Standard Elliptic Curve Cryptography Elliptic Curve Digital Signature Algorithm Electrically Erasable Programmable Read-Only Memory Galois Function Message Authentication Code Memory Management Unit
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NXP Semiconductors
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Secure dual interface and contact PKI smart card controller
Abbreviations ...continued Description Near Field Communication Operating System Public Key Cryptography Public Key Infrastructure Pseudo-Random Number Generator Random Number Generator Rivest, Shamir and Adleman SigIn-SigOut-Connection Single Fault Injection Secure Hash Algorithm Surface Mounted Device Simple Power Analysis Trusted Platform Module Universal Asynchronous Receiver/Transmitter
Table 6. Acronym NFC OS PKC PKI PRNG RNG RSA S2C SFI SHA SMD SPA TPM UART
9. Revision history
Table 7. Revision history Release date 20080124 Data sheet status Objective short data sheet Change notice Supersedes P5CX02X_40_73_80_144_ FAM_SDS_2 Document ID P5CX012_02X_40_73_80_ 144_FAM_SDS_3 Modifications:
* * *
Type number P5CD012 added Table 3 "Ordering information" corrected and new type number added Figure 2 added Objective short data sheet Objective short data sheet P5CX02X_40_80_144_FAM _SDS_1 -
P5CX02X_40_73_80_144_ FAM_SDS_2
20070424
P5CX02X_40_80_144_FAM 20070216 _SDS_1
P5CX012_02X_40_73_80_144_FAM_SDS_3
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NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
10. Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
10.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. MIFARE -- is a trademark of NXP B.V. FabKey -- is a trademark of NXP B.V.
11. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
16 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
12. Tables
Table 1. Table 2. Table 3. Table 4. Naming conventions . . . . . . . . . . . . . . . . . . . . . .2 Quick reference data . . . . . . . . . . . . . . . . . . . . .9 Ordering information . . . . . . . . . . . . . . . . . . . . .9 Feature table . . . . . . . . . . . . . . . . . . . . . . . . . .10 Table 5. Table 6. Table 7. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
13. Figures
Fig 1. Functional diagram P5CC021/P5CC040/P5CC073/P5CC080/ P5CC144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 Functional diagram P5CD012/P5CD020/P5CD040/P5CD080/ P5CD144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Functional diagram P5CN080/P5CN144 . . . . . . .13
Fig 2.
Fig 3.
continued >>
P5CX012_02X_40_73_80_144_FAM_SDS_3
(c) NXP B.V. 2008. All rights reserved.
Objective short data sheet
Rev. 03 -- 24 January 2008
17 of 18
NXP Semiconductors
P5Cx012/02x/40/73/80/144 family
Secure dual interface and contact PKI smart card controller
14. Contents
1 1.1 1.2 1.3 1.4 1.4.1 1.4.2 1.4.3 1.5 1.5.1 1.5.2 1.5.3 1.6 1.7 1.8 2 2.1 2.2 2.3 2.4 3 3.1 4 5 6 7 8 9 10 10.1 10.2 10.3 10.4 11 12 13 14 General description . . . . . . . . . . . . . . . . . . . . . . 1 SmartMX family approach . . . . . . . . . . . . . . . . 1 SmartMX family properties . . . . . . . . . . . . . . . . 1 Naming conventions . . . . . . . . . . . . . . . . . . . . . 2 Cryptographic hardware coprocessors . . . . . . . 2 FameXE coprocessor . . . . . . . . . . . . . . . . . . . 2 Triple-DES coprocessor . . . . . . . . . . . . . . . . . . 2 AES coprocessor . . . . . . . . . . . . . . . . . . . . . . . 2 SmartMX interfaces . . . . . . . . . . . . . . . . . . . . . 3 SmartMX contact interface . . . . . . . . . . . . . . . . 3 SmartMX contactless interface . . . . . . . . . . . . 3 SmartMX S2C interface . . . . . . . . . . . . . . . . . . 3 Security features. . . . . . . . . . . . . . . . . . . . . . . . 4 Security evaluation and certificates . . . . . . . . . 4 Optional crypto library. . . . . . . . . . . . . . . . . . . . 4 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Standard family features . . . . . . . . . . . . . . . . . . 5 Product specific family features . . . . . . . . . . . . 6 Security features. . . . . . . . . . . . . . . . . . . . . . . . 7 Design-in support . . . . . . . . . . . . . . . . . . . . . . . 8 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application areas . . . . . . . . . . . . . . . . . . . . . . . 8 Quick reference data . . . . . . . . . . . . . . . . . . . . . 9 Ordering information . . . . . . . . . . . . . . . . . . . . . 9 Functional diagram . . . . . . . . . . . . . . . . . . . . . 11 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 24 January 2008 Document identifier: P5CX012_02X_40_73_80_144_FAM_SDS_3

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